Hybrid Mounting Capability: Mixes semiconductor and SMD component placement in one process.
High Placement Speed: Achieves up to 10,800 CPH under optimal conditions.
Precision Placement: Ensures ±15μm placement accuracy with a Cpk value of 1.0 or higher.
Advanced Camera System: Equipped with a multifunctional camera for high-precision component recognition.
Flexible Feeder Options: Supports a wide range of feeders for diverse component types and sizes.
Electric Feeder Support: Compatible with electric intelligent feeders for improved efficiency.
Customizable Layout: Adaptable to various production processes with a customizable layout structure.
Post-Mounting Inspection: Standard feature for quality assurance after component placement. 9 Robust Power Supply Requirements: Compatible with a wide range of voltages and frequencies for global use.
Compact Design: Offers a space-efficient solution with a small footprint in the production line