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SH2012 Wire Bonding Machine
The SH2012 Wire Bonding Machine is a specialized device designed for high-precision bonding applications in the semiconductor industry. Its advanced features cater to the needs of various electronic components, making it an essential tool for high-quality assembly processes.
Gold Wire Ball Bonding: Ideal for inner lead welding in high-power LEDs and other semiconductors.
Versatile Applications: Suitable for LEDs, laser tubes, power diodes, triodes, and integrated circuits.
Adjustable Ultrasonic Power: 4 channels with 0~3W continuous adjustment for precise control.
Welding Time 0~200ms: Two channels allow for variable bonding durations.
Welding Pressure 35~180g: Two channels with adjustable pressure for different bonding needs.
Minimum Welding Time 0.4s/Line: Efficient processing for high-volume production.
Tail Wire Length 0~2mm: Customizable for specific bonding requirements.
Golden Ball Size Adjustable: 2~4 times wire diameter for versatile bonding.
Moving Range of Fixture Φ25mm: Ensures precise positioning for delicate components.
Two Gear Microscopes (15x and 30x): Provides clear visualization for accurate bonding.
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