1. High-Speed Camera: 5M pixel smart camera for detailed inspections.
2. Telecentric Lens: Provides 5M pixel clarity with 8-10mm depth of field.
3. RGB LED Lighting: Multi-angle illumination for consistent visibility.
4. Digital Control System: Advanced light and detection parameter management.
5. Detection Algorithms: Template matching, intelligent detection, and circle detection.
6. IPE Technology: Customizable image processing for enhanced detection.
7. High Processing Speed: Under 170ms per FOV for swift analysis.
8. Accurate Detection Speed: 3500mm²/s for efficient quality control.
9. Offline Programming: Graphical interface for precise, remote debugging.
10. Mark Point Selection: Choose multiple reference points for accuracy.
11. Comprehensive Test Coverage: Detects defects in solder paste, SMT, reflow, wave soldering.
12. Antistatische Maßnahmen: Ausgestattet mit antistatischer Buchse und Ring.
13. Flexible PCB Handling: Adjustable for sizes 35×35mm to 450×330mm.
14. Robust Mechanical Design: Servo motor system ensures ≤8um precision.
15. Leistungsstarke Hardware: I5 CPU, 8GB GPU, 16GB RAM für zuverlässigen Betrieb.