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インラインソルダーペースト検査機 S8080
The 3D SPI S8080 is an advanced solder paste inspection machine that combines Programmable Spatial Light Modulation (PSLM) with Phase Measurement Profilometry to achieve high-precision solder paste inspection. It is equipped with a 5M pixel camera, telecentric lens, and a real-time dynamic Z-axis tracking system, ensuring accurate detection of defects and warpage in PCBs.
1. PSLM Technology: Eliminates mechanical wear, enhances accuracy.
2. High Detection Resolution: 0.37um precision, 4-8x sampling for repeatability.
3. 3D Diffuse Lighting: Overcomes shading issues, versatile substrate compatibility.
4. Active RGB 2D Light Source: Patented RGB Tune for false alarm reduction.
5. Z-Axis Dynamic Tracking: Solves warpage issues in flexible circuits and PCBs.
6. User-Friendly Programming: Quick and easy setup with Gerber module.
7. Efficient Operation: One press operation, reduces training time.
8. Static Process Control Software: Real-time SPC, various export formats.
9. High-Resolution Camera: 5M pixels for detailed inspection.
10. Telecentric Lens: Ensures consistent image quality across the field.
11. Fast Field of View Speed: 0.45s per FOV for high throughput.
12. RGB Light Source Option: Enhances defect detection on various substrates.
13. Real-time Z-Axis Compensation: Standard for warpage management.
14. Versatile Measurement Range: From 100um to 460x460mm PCBs.
15. Robust Hardware: High-performance IPC with Intel i7, 24GB RAM, and Windows 10.
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