{"id":158,"count":1,"description":"The COB (Chip on Board) Bonding Machine is a specialized equipment used in advanced electronic packaging. It directly attaches bare semiconductor chips to substrates or PCBs. The machine precisely places and bonds chips using methods like thermosonic bonding or adhesive dispensing. It often incorporates features such as fine alignment systems, temperature control, and force regulation. COB bonding enables compact, high-performance designs by eliminating traditional chip packaging, making it crucial in applications where space is at a premium.","link":"https:\/\/v2smt.com\/es\/categoria-producto\/cob-bonding-machine\/","name":"M\u00e1quina de pegado de COB","slug":"cob-bonding-machine","taxonomy":"product_cat","parent":0,"meta":{"order":["0"],"thumbnail_id":["21709"],"display_type":[""],"product_count_product_cat":["1"]},"_links":{"self":[{"href":"https:\/\/v2smt.com\/es\/wp-json\/wp\/v2\/product_cat\/158","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/v2smt.com\/es\/wp-json\/wp\/v2\/product_cat"}],"about":[{"href":"https:\/\/v2smt.com\/es\/wp-json\/wp\/v2\/taxonomies\/product_cat"}],"wp:post_type":[{"href":"https:\/\/v2smt.com\/es\/wp-json\/wp\/v2\/product?product_cat=158"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}